There are many companies that are dedicated to offering a large number of technological advances that allow us to increase the performance of computer systems, and one of those that dedicate a large part of their development to this aspect is SK Hynixa South Korean company known for its solutions in terms of storage and memory. Now, the company has announced during its own event what we can expect next year, which will come full of surprises since they have created the first memory HBM3E of 16 Hi and they will also seek to offer new SSD PCIe 6.0 high speed.
Currently there are many companies dedicated to the development and creation of new technologies related to memory or storage, but in terms of technological advances, we can name Samsung, SK Hynix and Micron as the most important due to everything they have presented. Now we know what new features one of them brings, and they have presented a series of developments that attract a lot of attention since they will allow us to move forward.
The great technological advances of SK Hynix go through the PCIe 6.0 standard
One of the components that has evolved the most in recent years is the storage unit, something that we cannot deny considering that in a very short time we have gone from using a standard that has been used practically all our lives to one that, even though it is relatively recently, it has managed to dominate a large part of the market. Drives that connect via PCIe have managed to become common in both desktop and laptop computers, offering extremely high speeds, with a really small physical size.
PCIe 5.0 offers extremely high speeds, but not many people can get a drive that supports this format as they are extremely expensive, but SK Hynix is already thinking about going one step further and offering units PCIe 6.0. These high-capacity storage devices would be based on QLC and UFS 5.0 technologies.
Another of the really important aspects, they present the first 16 Hi HBM3E memory
In addition to having announced the creation of SSDs that will completely revolutionize storage, they have also indicated something that is extremely important, the creation of memory HBM3E which can have a capacity of up to 48GB per stack. The company had a large amount of efforts focused on developing the HBM4 memory, and even NVIDIA has tried to pressure the company by indicating that they would need to have it ready within 6 months so that it can be applied to the new features brought by the brand that created the RTX. so the arrival of this advanced version of HBM3 is quite impressive.
This 16-layer memory is designed, according to the company, to address the changes in terms of performance and efficiency that have come from artificial intelligence, trying to stabilize the technological market a little, and the fact that they offer 48 GB practically doubles what current AI accelerators offer, both from AMD and NVIDIA, and is also much faster by improving the LLM training speed by 18%.
