Qualcomm is preparing to launch a new high-end Snapdragon chip that will be found in premium smartphones at the end of the year, and before its launch, we now know more about it.
Every year, Qualcomm unveils a new high-end chip for smartphones, and this year, the company will bring forward the presentation date. The Snapdragon 8 Gen 4, which we will call this for the moment, will be revealed at the beginning of October, which will also probably push some manufacturers to bring forward the launch date of their smartphones.
Before its official release, we have just learned a little more about it, particularly in terms of its engraving finesse, the cores and other technologies that will be on board. Leaker @chunvn8888 was the first to share some information about X, but we were able to view the confidential Qualcomm document which confirms some new features of the chip.
What can we expect from Qualcomm’s next processor?
According to the internal document, The Snapdragon 8 Gen 4 will be available in two versions, which bear the numbers SM8750 and SM8750P. It’s unclear why two versions exist, but it could well be that the second is actually the “For Galaxy” model intended for Samsung, as was the case for previous generations.
However, unlike the previous Snapdragon 8 Gen 3, Qualcomm’s new chip will be engraved in 3 nm. This will not only provide better performance, but also better energy efficiency.
The document above all confirms the presence of “Qualcomm Oryon” cores, the same ones that we already find on the recent Snapdragon X Elite. They should therefore offer a significant power gain compared to the previous generation. No performance-related data is mentioned, but the CPU will be accompanied bya new “Adreno 8-series” GPU unspecified.
Note also the presence of the Qualcomm Snapdragon X80 for connectivity, and the Fastconnect 7900. The Snapdragon 8 Gen 4 will not only be compatible with Bluetooth 5.4, but also with Wi-Fi 7 (802.11be). Schematics of the chip are also present, but don’t reveal much about it. We will probably have to wait a few more weeks before knowing more.
The SM8750/SM8750P device is the new generation Qualcomm® Snapdragon™ premium-tier 5G SoC that has the integrated modem. It is designed with a 3 nm process, for superior performance and power efficiency.SM8750/SM8750P includes the following key components: Qualcomm® Oryon™ CPU
— Chun Bhai (@chunvn8888) March 8, 2024
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